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TAIKO, developed by DISCO Corporation, is a wafer backgrindingprocess that uses a newgrindingmethod. It is used for reducing the risk of thin wafer handling and lowering the warpage. Thegrindingprocess in TAIKO leaves anedge(approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.
[email protected]As a leading global manufacturer of crushing equipment, milling equipment,dressing equipment,drying equipment and briquette equipment etc. we offer advanced, rational solutions for any size-reduction requirements, including quarry, aggregate, grinding production and complete plant plan. If you are interested in these product, please contact us.
The requirement for the wafer quality is getting higher and the condition of waferedgeis getting more important. Theedgegrinders “W-GM series” processedge grindingof various kind of materials such asSilicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures ofsilicon, compound materials and other wafer shaped materials.
Get PriceFukuno Plant. 641 Nojiri, Nanto City, Toyama 939-1502,JapanTel +81-763-22-2165 Fax +81-763-22-6218
Get PriceIntroducing theEdgeGrinder series that brings NC-controlledgrindingto the chamfering process onsiliconand other wafers for the first time in the world. Besides the WBM series, in wide use and still regarded as the industry standard, we will be releasing the …
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Get Pricejapan silicon edge grinding equipment. High Precision Polishing Service by the number one Know More. High Precision Polishing Service by the number one polishing firm inJapanSiC MEMSSiliconcarbide Polishing-affiliated process such asedge-grinding... Metallographic AbrasiveGrinding
Get PriceEdge Grinderisequipmenttogrind edgeof all kinds of substrate materials for a specified profile. Our wide range ofEdge Grinderlineup can support substrates of any material kind, such assilicon,metal, SiC, sapphire and oxide substrates, featuring easy operation and maintenance. WIFG-300
Get PriceFukuno Plant. 641 Nojiri, Nanto City, Toyama 939-1502,JapanTel +81-763-22-2165 Fax +81-763-22-6218
Get PriceMetal Bond Wheel for High Accuracy ProfileGrinding"KeepEdge" General-use Multi-pore DiamondGrindingWheel "SD MEMOX" Poreless Vitrified Diamond PCDGrindingWheel "Smooth Fine" SurfaceGrindingWheel for Solar CellSiliconIngots; Porous Vitrified-bonded Diamond Wheel "VDH Wheel" Vitrified-bond Wheel for Cutting Tip OuterEdge Grinding"VTS ...
Get PriceWafer Edge Grinders. Since introducing the world’s first Numeric ControlledEdgeGrinder over 30 years ago, Daitron has continued to make improvements in quality and yield to the processing ofSiliconand other semi-conductive materials. The latest V-Twin contouring technology utilizes the 2 axis verticalgrindingprocess. This system assures ...
Get PriceIt is the page for our semiconductor manufacturingequipment. It introduces thewafermanufacturing system. FAQ; ...Wafer Edge GrindingMachine: W-GM-6200.EdgeGrinder for Forefront 450 mmWafer. Catalog PDF (393.7KB)Wafer Edge GrindingMachine: W-GM-5200. Top Share in 300 mm Si Market.
Get PriceOursiliconwafer manufacturing process can be divided into two stages, namely, pulling single crystal ingots and slicing and polishing thesiliconwafers. ... PeripheralGrinding... Various types ofgrindingstones are used to shape waferedgeto meet Costomers' uniqueedge…
Get PriceSpeedFam is the comprehensive manufacturer ofgrinding, lapping and polishingequipmentand the consumables with process support for various electronic and mechanical materials ... T A I W A N; U. S. A.EdgeGrinder OurEdgeGrinders offer high quality processing for various materials with broad lineup including high yield model of 2grinding...
Get PriceUS8192822B2 US12/415,555 US41555509A US8192822B2 US 8192822 B2 US8192822 B2 US 8192822B2 US 41555509 A US41555509 A US 41555509A US 8192822 B2 US8192822 B2 US 8192822B2 Authority US United States Prior art keywordsedgewafer wafers point etchant Prior art date 2008-03-31 Legal status (The legal status is an assumption and is not a legal conclusion.
Get PricePolishing & Grinding Manufacturers - Wafer Production Equipment. Companies involved inPolishing&Grindingmachine production, a key piece ofequipmentfor the production of solar wafers. 27Polishing&Grinding equipmentmanufacturers are listed below.
Get PricePrecisionGrinding; Optical; Our top of the line machinery makes refining, smoothing edges, and adding dimensional details a breeze. With a parallel and perpendicular tolerance of .0005, ourequipmentis capable of beveling, stepgrinding, flared edges, chamfering, radiuses, and much more.
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Get PriceDiamond Tool Store offers floor grinders forgrindingand polishing floors, most often used for concrete prep work, coatings removal, and concrete restoration. These FloorGrindingMachines are typically heavier and more aggressive than Swing Machines or Floor Polishers. They are used to grind several types of floors, but mainly used on concrete.
Get Pricegrindingcutting machine basically complete your laserequipment, enabling proficient working of your devices. Laser generator, lenses, CNC systems,grindingcutting machine, etc. are some commonly bought products involving laser-related uses.grindingcutting machine help to improve the accuracy and precision of the laserequipmentmachines ...
Get PriceShinko Homes cutter Auto Blade Knife Sharpener PolishingGrindingMachineJapan. 4.5 out of 5 stars (7) 7 product ratings - Shinko Homes cutter Auto Blade Knife Sharpener PolishingGrinding... Fix angle Knife sharpener Manual sharpedge grindingmachineedgesharpener Y. $85.00. $16.99 shipping. 5 watching. Electric Tool Sharpener Hair Clipper ...
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Get PriceGrindingof hard-to-grind materials such as alloyed steel, tool steel, quenched steel:Siliconcarbide abrasive grain: GC Ultra high hardness and highly friable.Grindingof sintered hardmetals, cast iron, non-ferrous metal, ceramic, etc. C Standardsiliconcarbide abrasive.Grindingof …
Get PriceEP-300-X /EP-200-X. The SpeedFam EP-X series are high throughputEdgePolishers for 300mm, 200mm and 150mm primesiliconwafers. As well as our unique three surface polishing (upper/lower bevels and wafer apex) we also provide orientation flat and notch region mirror polishing to remove damage and prepare the entire domain of theedgebevel area.
Get PricePortable Small manual glassedgepolishing machine. The portable glassedgepolishing machine is a new generation ofgrinding edge equipmentwhich is successfully developed on the basis of the desktop. The power is 850 watts, and the lighting power can be used. The machine is easy to operate and the effect. Read More
Get PriceGEOTEX fabrics are used to protectequipmentand personnel near hazardous operations, such as welding, flame cutting,grindingor spraying. The fabrics are made up of fiberglass,siliconand silica materials with working temperatures ranging from 500° C …
Get PriceCAE has 2476wafer grinding, lapping & polishingcurrently available for sale from a number of respected OEMs, including SPEEDFAM, DISCO, STRASBAUGH and many others. You can choose from a selection of manufacturers and models, such as ACCRETECH / TSK W-GM-4200B , AMAT / APPLIED MATERIALS Mirra Mesa or DAITRON WBM-210 .
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Get PriceFigure 3.5 Preparation damage (arrows) in annealed CP titanium (500X, DIC, Kroll's reagent). A Planargrindingmachine, like the PlanarMet 300 planargrindingmachine shown in Figure 3.3, utilizes a fixed abrasive stone for rapid samplegrinding. This type of automated grinder produces planar samples in 1-2 minutes replacing up to 3 traditionalgrindingsteps.
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Get PriceGlass Grinding Wheelsare manufactured by our expert professionals using excellent raw material and the most up to date technology. Thoroughly examined by our quality control team, thesegrindingwheels for glass are in high demand because of extremely accurate dimensions, great tensile power and exceptional durability.
Get PriceMar 30, 2009· DISCO Corporation (TOKYO:6146) providesequipmentand process solutions to the semiconductor and electronics industries utilizing our core technologies of kiru (cutting), kezuru (grinding…
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