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japan silicon edge grinding equipment

japan silicon edge grinding equipment

TAIKO, developed by DISCO Corporation, is a wafer backgrindingprocess that uses a newgrindingmethod. It is used for reducing the risk of thin wafer handling and lowering the warpage. Thegrindingprocess in TAIKO leaves anedge(approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

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